Masters PhD Partial funding

Tecterra Work-Integrated-Learning Experience Prize 2026

Posted on: 11 Dec, 2025 Deadline: 15 May, 2026
Tecterra Work-Integrated-Learning Experience Prize 2026

The Tecterra Work-Integrated-Learning (WIL) Experience Prize at the University of Lethbridge is awarded to a student who demonstrates outstanding participation, excellence, and commitment during a WIL placement related to Computer Science, GIS, Geography, or Remote Sensing. Valued at $5,000, this prize is open to full-time University of Lethbridge students or recent graduates within one semester of completion. No application is required, as candidates are nominated by the Department of Geography, with nominations coordinated through Scholarship and Student Finances. This award recognizes students who have shown exceptional performance in their WIL experience, contributing meaningfully to applied learning in their field.

  1. Application Deadline: May 15, 2026
  2. Value: $5,000 (1 award)
  3. Study Level: Master’s & PhD
  4. Sponsor: University of Lethbridge
  5. Course to Study: Computer Science, GIS, Geography, Remote Sensing (Work-Integrated Learning related)
  6. Eligible Country: All countries

Eligibility Criteria for Tecterra Work-Integrated-Learning Experience Prize 2026

  1. Participation in a Work-Integrated-Learning experience related to Computer Science and GIS, Geography or Remote Sensing
  2. Demonstrated commitment and excellence in the Work-Integrated-Learning experience
  3. Must be an enrolled University of Lethbridge student in any program or must have completed degree requirements within one semester of the nomination date.

Benefits of Tecterra Work-Integrated-Learning Experience Prize 2026

  1. $5,000 award for excellence in a Work-Integrated-Learning experience

How to Apply

No application is necessary. Nominated by the Department of Geography, and nominations will be solicited by Scholarship and Student Finances.

For more information, visit University of Lethbridge Scholarship webpage

Application Deadline

May 15, 2026

Application Link(s)

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